Application methods for the thermal design of enclosures
When designing electronics, the focus should naturally be on "electronics". However, the electronics themselves need to work within some kind of enclosure; The enclosure can be a standard rack system1 or a custom enclosure, such as the enclosure of a smartphone or tablet, or it can be part of another product, such as a car dashboard or aircraft cockpit.
Nov 12,2021
When designing electronics, the focus should naturally be on "electronics". However, the electronics themselves need to work within some kind of enclosure; The enclosure can be a standard rack system1 or a custom enclosure, such as the enclosure of a smartphone or tablet, or it can be part of another product, such as a car dashboard or aircraft cockpit.
Regardless of the situation, including standard rack systems, electronics must be designed with the enclosure in mind, as the enclosure can hinder or help transfer heat to the surrounding environment, or both. Heat dissipation is a system issue, and we advocate a top-down approach, which is why we design from the enclosure.
The airflow inside the enclosure is often complex, making CFD the only viable way to develop a successful design. Airflow is influenced by the design of the electronics and the enclosure, so the interaction between the electronics and the enclosure constitutes the thermal environment of the application. In the vast majority of cases, the heat dissipation medium is mainly ambient air. Even in products with limited space, such as laptops, designers need to look at air circulation to improve heat dissipation, but in this case heat dissipation and heat conductivity are more important.
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