At present, the common types of substrates include rigid printed circuit boards, aluminum substrates with high thermal conductivity, ceramic substrates, flexible printed circuit boards, metal composite materials, etc. Generally, low-power LED packaging can meet the needs of PCB version used in the general electronics industry, but most LED packages above 0.5W are switched to metal and ceramic high-heat dissipation substrates, mainly because the heat dissipation of the substrate has a direct impact on the life and performance of LEDs, so the packaging substrate has become a high-brightness LED product designA very important component for the application.
Nearly 80% of the conversion of electricity into light is heat. With so much heat, it's impossible to completely remove that amount of heat with two pins. We rely on heat sink to dissipate heat. In fact, a large amount of heat in such a small space will not burn off the particles, but it will make the light weaker and weaker, which is what we usually call light decay. Only the faster the heat is dissipated, the smaller the light decay.